Services
Our expertise and facilities allow the following:
- Detector development (Gas Electron Multipliers, Semiconductor Pixel/Strip Detectors, Scintillators)
- Wire and Flip-Chip bonding
- Bond quality analysis, with pull tests and optically
- Fast environmental testing (15 K/min, -70/+150 degrees, 10-90 RH%, MIL standards)
- Wafer/chip probe-measurement
- Prototype assembly
- Morphological surface analysis
- Current-voltage / capacitance-voltage characterization
- Optical scanning